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ArcticPro eFPGA is being licensed by several Tier-1 customers for integration into their SoCs.

NXP Embraces 28nm FDSOI for MCUs

PARIS—NXP is set to extend the use of 28nm fully-depleted silicon-on-insulator (FDSOI) process technology down to its low-power LPC microcontrollers, according to Goeff Lees, newly installed as general manager of MCU business at NXP Semiconductors NV.

If NXP was in at 28...there was NO eMRAM...thwy should REALLY like 22 FDX!

Sign them up for eFPGA?

Oh already have?

NXPs MCU SoCs....Their adjacent possible is the 22FDX.  QUIKs Adjacent possible is this Tier 1, now going to QCOM...will track along.

1. vk11dd6, Thursday at 12:50 PMReport

   #62LikeReply

   wkav likes this.
2. 

   jfiebWell-Known Member

   
   

   homework for me had to do with Glo Fo 22FDX memory as Dr Saxe mentioned it...
   
   
   GLOBALFOUNDRIES Launches Embedded MRAM on 22FDX® Platform
   Sep 15, 2016
   
   High-performance embedded non-volatile memory solution is ideally suited for emerging applications in advanced IoT and automotive
   
   Santa Clara, Calif., September 15, 2016-GLOBALFOUNDRIES today introduced a scalable, embedded magnetoresistive non-volatile memory technology (eMRAM) on its 22FDX platform, providing system designers with access to 1,000x faster write speeds and 1,000x more endurance than today’s non-volatile memory (NVM) offerings. 22FDX eMRAM also features the ability to retain data through 260°C solder reflow, industrial temperature operation, while maintaining an industry-leading eMRAM bitcell size.
   
   GF's eMRAM will be offered initially on its 22FDX platform, which leverages the industry’s first 22nm fully-depleted silicon-on-insulator (FD-SOI) technology. This versatile eMRAM technology is designed for both code storage (flash) and working memory (SRAM) to enable ultra-efficient memory sub-systems that can be power cycled without any energy or performance penalty. The power efficiency of FDX™ and eMRAM, coupled with the available RF connectivity IP, makes 22FDX an ideal platform for battery-powered IoT products and automotive MCUs.
   
   now with flexibility of eFPGA too, nice total package.....
   
   “Customers are looking for a high-performance non-volatile memory solution that expands their product capabilities," said Gregg Bartlett, senior vice president CMOS Platforms Business Unit, GF. "Our introduction of 22FDX eMRAM enables system designers with new capabilities, allowing them to build greater functionality into their MCUs and SoCs, while enhancing performance and power efficiency.”
   
   The emergence of autonomous vehicles is rapidly driving the need for increased on-chip memory capacities required for real-time vision processing, high-precision, continuous 3D mapping data and next-generation automotive MCUs that update over-the-air. GF's eMRAM uniquely addresses these advanced driving assistance system (ADAS) requirements by combining greater memory density than SRAM, with the fast write, very high endurance, and non-volatility that only magnetoresistive memory can provide.
   
   “Emerging non-volatile memories are moving from the lab to the fab,” said Thomas Coughlin, President of Coughlin Associates. “GF's 22FDX eMRAM will offer a major advancement in SoC capabilities, by leveraging the key performance attributes of embedded MRAM. Designers of battery powered IoT devices, automotive MCUs and SoCs and SSD storage controllers will certainly want to take advantage of this versatile embedded NVM technology.”
   
   The introduction of GF's 22FDX eMRAM is a result of the company’s multi-year partnership with MRAM pioneer, Everspin Technologies. The partnership has already delivered the world’s highest density ST-MRAM in August, 2016 – Everspin’s 256Mb DDR3 perpendicular magnetic tunnel junction (pMTJ) product, which is now successfully sampling and is being readied for mass production at GF.
   
   GF's 22FDX eMRAM is currently in development and is expected to be available for customer prototyping in 2017, with volume production in 2018. GF's eMRAM technology is scalable beyond 22nm and is expected to be available on both FinFET and future FDX platforms.
   
   so i learned something, but will read it a few more times

1. 
   

   Glo Fo has a Blog...A lot of fun to read
   
   old Saxony
   
   https://blog.globalfoundries.com/22fdx-ramping-new-silicon-old-saxony/
   
   FDX 22 At Dresdens Fab 1
   
   
   dang what a complex...
   
   I’ve been managing Fab 1 in Dresden since 2011 and the differences from then to now can hardly be overstated. When I got here our production capabilities, technical resources and mode of operation didn’t match our ambition. Today, Fab 1 is quite simply one of the best fabs in the entire world, and we have a superb staff of technical people, managers and operating personnel who are aligned on achieving world-class operational metrics and customer satisfaction.
   
   
   
   GLOBALFOUNDRIES, Fab 1, in Dresden is Europe’s Largest 300mm Factory
   
   This evolution has been driven by investment, by more efficient use of technology and by great execution. We have invested more than $12 billion in Fab 1 to date,
   

   jfieb, 10 minutes agoEditDeleteReport

   #100Reply
2. 

   jfiebWell-Known Member

   New
   

   
   

   a nice read
   
   FD-SOI Rises to the Challenge
   
   
   https://blog.globalfoundries.com/fd-soi-rises-challenge/
   
   
   We chose FD-SOI over bulk planar or FinFET because it offers the best combination of performance, power and area for these applications. 22FDX is unmatched by any competing 22nm technology in several areas:
   
   

   • The lowest operating voltage (0.4 volt)
   • The most cost-effective CPP and MX scaling
   • The lowest mask count
   • The best RF performance
   • The only technology to offer software-controlled transistor body-biasing

   And while others are announcing their offerings now, 22FDX is fully qualified for production at our Fab 1 facility in Dresden, Germany. We are seeing strong customer demand, with more than 50 active engagements in high-growth areas such as mobile, IoT, and automotive.
   

   jfieb, 5 minutes agoEditDeleteReport

   #101Reply
3. 

   jfiebWell-Known Member

   New
   

   
   

   In-depth with John Volkmann – GF’s New VP of Corporate Marketing and Communications
   
   https://blog.globalfoundries.com/depth-john-volkmann-gfs-new-vp-corporate-marketing-communications/
   
   
   I see GF as a company with a lot of potential for industry leadership. The foundry business is fairly stable with a single, relatively complacent leader taking more than their “fair share.” It’s a huge, growing industry, ripe for disruption, and I see GF as the only company seizing the opportunity to shake things up. Customers don’t like too much concentration of power in their suppliers, and with the company executing well, I think it could gain meaningful share in the next few years.
   
   
   
   The technology industry is such a roller coaster. Every time I think things are slowing down, some massive, foundation-shifting trends arise (e.g., Internet, smartphones, social media, cloud computing) that keeps demand for semiconductor content growing at a remarkable pace. Today’s examples are IoT, augmented and virtual reality, and self-driving cars. Those who capture disproportionate share of silicon spend in these emerging segments will be industry leaders for at least the next decade. This is GF’s opportunity – not to take share from today’s available market – but to win more than our historical share in these exciting growth areas. I think we have as good a shot as anyone else, and better than most.