Tuesday, October 27, 2015

FYI= Trimble is also a member of the inlocation alliance. Its a small group and so QUIK's person and Trimble's person have met……

so what would Trimble know about location?


A lot, a whole LOT.
The coffee house of possibilities is just on a caffeine roll.

Maybe QUIK will hire more Trimble people…..like This guy….or someone just like him?

read this snip of text….
A Trimble guys CV


Background
Summary


Technical Business Developer, over the last 14 years I have managed and contributed individually to a number of complex projects. I have built executive working relationships with over 250 companies in Indoor Location, LBS, Automotive and GNSS industries

Most recently my work has focused on Indoor Localization Technologies, Use Cases and Business Models. In addition to discovering and creating technologies (patents pending) I fostered cross company collaborations through a series of Indoor Location Workshops. To promote communications and interchange I created a comprehensive internal website and social group. To manage my company’s interests I contributed at a high level in industry organizations including; the In location Alliance (ILA) and Open Geospatial Consortium (OGC). I also monitored other industry standards development organizations; 3GPP, WFA and BTSIG.

I am currently seeking roles where I can contribute to the success of bringing innovative products to the indoor location market.

Previously I have contributed with same high level of passion and attention to detail with projects including; development and licensing of GSP silicon, software defined GPS receivers, GPS chipsets, GPS modules, GPS algorithms and GPS IPR.

Specialties:
GPS / GNSS, Indoor Location, Mobile, LBS, Business Development, Collaborative Development, Intellectual Property, Licensing, Technical Marketing, Product / Project / SW Engineering Management, Semiconductors

Please contact me

Experience
[​IMG]
Director of Technical Business Development
Trimble
2007 – 2015 (8 years)Sunnyvale, CA
Reported to Executive VP, responsible for Indoor Positioning research, development and promotion. Managed internal developments and relationships with market leading providers. Cross company champion for indoor positioning. Technical due diligence for M&A activities.
• Trimble representative to InLocationAlliance.com (ILA) a global alliance promoting rapid adoption of indoor Positioning eco system, key contributor to System Architecture, Use Case and Promotion working groups. Co-authored System Architecture and Use case white papers. Liaison to Open Geospatial Consortium (OGC).



So QUIK you know this guy….

• Conducted 3 cross company Indoor Positioning workshops with 20-30 people from 20 divisions, to determine divisional capabilities, product plans, use cases, requirements, business cases and innovated technical solutions. Nurtured cross division collaborations, resulting in several joint product plans and developments. Authored 4 indoor positioning patent applications, two have since issued.
• Developed & demonstrated internal RFID based positioning technology. Shortest time to find downed firefighter in live simulated search and rescue at WPI Precision Personnel Location conference. (less than 5 minutes against a baseline of more than 22 minutes)
• Managed development of TDMB positioning technology coordinating efforts between several international companies targeting a market of 100,000’s of mobile TV’s and 35 million mobile handsets. Successful live demonstration to KBS in South Korea.

[​IMG]
Director of Chipsets & Licensing
Trimble
March 2001 – 2007 (6 years)Sunnyvale, CA
Reported to VP/GM/CTO, responsible for development of global market for GPS chipsets, and licensing for GPS silicon integration, GPS software defined radios and GPS IPR.
• Brought FirstGPS™ chipset to market including, license agreements, pricing, advertising, market studies, training programs and software development. Extensive international travel, executive level presentations, marketing and trade shows. Licensed several customers attaining 10K to 50K quarterly units (Bosch Blaupunkt, Infineon, SVDO, Xemics, Epson, Wavedigm)
• Brought SW defined GPS receiver to market. Cooperatively promoted with Texas Instruments. Licensed to Marvell and has shipped over 100 million units.
• Technical due diligence for IPR cross license between Trimble and Nokia, $x million deal.
• Evaluation of Japanese miniaturization manufacturers Sanyo, Casio and Sharp to achieve lowest cost, smallest GPS receiver module, achieved 11x10mm module.
• Led transition from internal to external GPS chipsets for high volume GPS module business, comprehensive GPS supplier test, selected supplier, developed supplier relationship to offer Trimble navigation software with supplier GPS chipset. Shipped millions of GPS modules.

[​IMG]
SW Engineering Manager / Director SW. Eng.
Trimble
April 1996 – March 2001 (5 years)Sunnyvale, CA
Reported to VP/GM responsible for SW engineering teams supporting Automotive, Embedded and Timing business units, and development of global In Vehicle Navigation business
• Built SW team from 2 to 8 members, managed design, development, test, bug tracking, release and manuals under ISO processes. Co authored ISO processes. Multiple release cycles for several high volume (millions of units) product families based on 3 generations of GPS technologies, where the largest customers were tier one automotive suppliers; SVDO, Bosch Blaupunkt, Magneti Marelli, Xanavi, Delphi.
• Expanded automotive business through technical innovation, hosting customer applications on Trimble GPS main processor, and global travel to assist with systems integration.
• Significant embedded SW contributor; architecture, GPS algorithms, protocols, APIs, low power modes. 7 years embedded firmware development including prior Sr. SW engineer role.

[​IMG]
Firmware Project Manager
Trimble
December 1993 – April 1996 (2 years 5 months)Sunnyvale, CA
Established embedded GPS firmware development capability for several GPS OEM module families. Developed; GPS algorithms, communications, interface protocols, low power modes and manufacture configuration SW.
Established automotive grade release test process and ISO processes for high volume GPS modules

[​IMG]
Sr. Software / Applications Engineer
Aehr Test Systems
February 1986 – November 1993 (7 years 10 months)Menlo Park & Mountain View, CA
Semiconductor test system firmware, software, database and UI (created test vector editor)
Application engineering, international semiconductor test system integration in Asia and Europe
7 years SW engineering experience
 

Meanwhile, in another room in the MEMS sensor fusion coffee house, Miss Adjacent Possible, is firing up her Italian machine,
serving expresso for some very talented new arrivals who came to talk it over

  1. this folder can be read at a lesurely pace, as it tracks this along...

    In Nov. at MEMS congress.

    And last but not least, is Cambridge CMOS Sensors Gas Sensor (the CCS811), which offers a breath of fresh air in a tiny ultra-low power device. This metal oxide gas sensor co-packaged with a micro controller unit delivers a self-contained solution for assessing air quality in indoor environments. Whether embedded in a smartphone or integrated into a standalone device, CCS811 generates alerts to provide intuitive ways to evaluate air quality, opening up new application areas for improved health and wellbeing such as ambient air quality monitoring and breathe analysis in smartphones, tablets, wearables and Internet of Things (IoT) devices. This minute device has massive potential for enabling myriad applications that will have a positive impact on our world.

    So I hope you’ll join me soon in Napa, CA
     
  2. jfieb

    jfiebMember

    Air quality in Asia?


    This is a new name for me. I am happy as ams is the one that has made nice moves into this area and its nice to have competition to move it down the field.
    A very good segment for the mobile device, for sensors makers, for algo IP.


    [​IMG]

    Cambridge CMOS Sensors opens Taiwan office
    Southeast Asian office opened to capitalise on growing demand for environmental sensor solutions Cambridge CMOS Sensors (CCS), a leading manufacturer of sensor solutions for monitoring air quality, today announced that the company has opened its... More >
    North American power broker backs Cambridge technology
    Miniature, low-power CMOS gas sensors from a Cambridge innovator are being brought to a wider global market following an alliance forged between Cambridge CMOS Sensors (CCS) and global big-hitter Future Electronics. Canadian-headquartered Future... More >
    Cambridge CMOS Sensors to demonstrate air-quality monitoring and breath analysis on mobile devices at Sensor + Test 2015
    Breakthroughs in power consumption, cost and size mean that sophisticated gas sensor ICs can be integrated into phone, tablet and IoT designs for the first time Cambridge, UK, 12 May 2015 – Cambridge CMOS Sensors (CCS) announced today that it is to... More >
    May 2015 - Cambridge CMOS Sensors will be exhibiting at the Sensor+Test 2015...
    part of "The measurement fair' in Nuremberg Germany. Come and visit our team in hall 12 stand 566 and see how our unique technology is enabling a new generation of environmental sensor solutions. If you wish to speak to Cambridge CMOS Sensors... More >
     
  3. jfieb

    jfiebMember

    Sensors
    [​IMG]

    Cambridge CMOS Sensors MEMS Micro-hotplate technology provides a unique silicon platform for the Metal Oxide (MOX) gas sensors, enabling sensor miniaturisation, significantly lower power consumption and ultra-fast response times.

    The resistive Micro-hotplates are fabricated using a high reliability silicon dioxide membrane and include an embedded tungsten heater acting as a heating element for the MOX based sensing material. The micro-hotplate can be used to heat the MOX material to up to 450°C and the electrical resistance of the MOX sensing material can be monitored to detect the target gas. With extremely fast heater cycling times, temperature modulation techniques can be used to reduce the device power consumption and implement advanced gas sensing methods, resulting in class leading gas sensing performance.

    Can a micro hot plate make a micro cup of coffee? A smartphone as an expresso machine? ;-)


    Advanced algorithms support the MOX gas sensors family, for maximum sensitivity, selectivity, drift compensation, and for self-calibration; enabling easy and timely integration into a wide range of products and applications.

    The table below indicates the key product parameters for the CCS8xx product family of ultra-low power gas sensors


    Open question....I will track this along. We want QUIK Eos to be a host for such stuff. WIll the partner, open source, their algo chefs don't have this specialized skill set, yet.........it would be good to have. Imagine a future where environmental goes ubuitous and its in a brands flagship smartphone. It might seem like sci-fi- but we can just track along and ubiquity= a potential future engine....an environmental engine.




    Product Description Average Power Consumption¹ Heat Resistance Heater Voltage Package
    CCS801 Ultra-low power multi-gas sensor for indoor air quality monitoring ~1.3 - 2.1mW² ~50 - 66Ω 1.3 - 1.6V² 2x3mm DFN
    CCS802³ Ultra-low power gas sensor for monitoring carbon monoxide ~1.3mW ~55Ω ± 10% 1.3V 2x3mm DFN
    CCS803 Ultra-low power gas sensor for monitoring ethanol ~1.6mW ~58Ω ± 10% 1.4V 2x3mm DFN


    Notes:

    1. Average power consumption when operating in pulse mode, assuming a 0.5s micro-heater on period every minute

    2. Will vary depending on target gas being detected

    3. Carbon filter recommended

    CCS8xx Additional Informatio

    I want a smartphone with this stuff in it. Stay in an air B&B and sleep better knowing there is a built in CO monitor and alarm. A sentinal smartphone. A sentinal smartphone is exactly the kind of intelligence I want. Facebook apps will not save my life ( ?), but a sentinal smartphone that can tell me when the CO level is high before its too late.
     
  4. jfieb

    jfiebMember

    New
    This is a GOOD job. To change the whole world for the better...

    The company is based in Cambridge, UK and currently employs people in countries such as China, Taiwan, South Korea and USA.

    The following is a list of open vacancies for which we are currently recruiting:

    WHen I have the time I will update on ams moves in this segment and any very recent happenings for them. Maybe they will have news yet at the confabs of Nov/Dec.

    Would I buy a part of this English business? Yes, I would look them over carefully, but I can't. How can I invest in sensor hardware AND software?

    QUIKs experience in the partitioning of Sware & Hware, is so good as it is a skill set that they can use again and again. One day I hope to read of some
    partnership, open source, customer who uses Eos in the environmental MEMS sector.

    If you talk to QUIK, please ask them for me. If any customers who are in environmental sensing are running their algos on QUIK?

    Thanks in advance.
     
  5. jfieb

    jfiebMember

    what an interesting group of people.

    Did I notice anything?

    Yes, there is an overall trend seen these past 1-2 yrs.

    Of what?

    The talented veterans moving from the world they know, into small outfits on the cutting edge of the adjacent possible.

    S Whalley is one good example, Many of QUIK hires, and yesterdays news of Mr Stuart from Trimble, its not chance
    they can feel the potential here of the buzz of the sensor coffee house, of the richness of the fusion reefs...

    so look at where Cambridge CMos got its people



    Management Team
    Nat Edington
    Chief Executive Officer
    Nat has over 20 years' experience in fast paced technology companies, from start-ups and SMEs to global players. Prior to CCS, he was VP & General Manager at Wolfson Microelectronics for 8 years, managing their largest revenue businesses in excess of $100m with blue chip consumer customers. Previous roles include Board Directorship, General Management, Business Development, Strategic Marketing and Engineering in the semiconductor, electronic products and manufacturing sectors.
    Florin Udrea
    Chief Technical Officer
    Florin Udrea has over 20 years' experience in smart technologies, microsensors, MEMS, and power devices. He has an extensive track record in working with start-up companies from the University of Cambridge. For example, he is one of the two founders of CamSemi, a very successful company dedicated to energy-efficient power ICs. He is also a Professor of Semiconductor Engineering at Cambridge University and is the holder of more than 70 patents. Florin Udrea has been a consultant with several leading-edge companies in the field of sensors and power electronics.


    If you have some expertise in low power it is natural to move in this general direction, just like QUIK....

    Julian Gardner
    Chief Scientist
    Julian Gardner is a highly experienced CTO, a Professor of Electronic Engineering and Director of Cognitive & Neural Systems Centre at Warwick University. He is also a Senior Fellow of Cambridge University. He is Head of the Sensors Research Laboratory with 25 years of experience in microsensors, signal & data processing and micro/nanoengineering. Prof. Gardner has been a consultant with several start-ups in microsensors, such as AlphaMOS (France), Nanotecture Ltd UK, Cyrano Sciences (USA), Health & Safety Executive (UK), Hewlett-Packard (USA), and Honeywell (USA). Prof. Gardner is also a Fellow of the Royal Academy of Engineering (UK).
    Simon Stacey
    VP of Engineering & Operations
    Simon Stacey is a seasoned operations director with 20 years' semiconductor experience within fully integrated IDMs such as Fujitsu and Agilent Technologies, as well as high volume fabless environments like Cambridge Silicon Radio. He brings an extensive network of senior level relationships within, predominantly, Asian wafer fabs, outsourced semiconductor assembly and test houses (OSATs). Simon has held senior level positions in manufacturing and test operations where he has managed new product developments and production ramps to achieve a 100% on time delivery record for shipments in excess of 1Mu per day to consumer and automotive markets.
    Paul Wilson
    Marketing & Applications Director
    Paul Wilson, joined Cambridge CMOS Sensors December 2013 and has over 20 years' international experience in marketing, product management, applications and development gained at Cambridge Silicon Radio, Wolfson Microelectronics, Freescale Semiconductor and Philips. Paul has a proven track record of managing and developing new business with Tier 1 OEMs and ODMs in Asia, EMEA, Japan and USA in highly competitive markets including Audio, Consumer, Enterprise and Mobile.
    Mohamed Foysol Chowdhury
    Director of R&D Projects
    Foysol Chowdhury, has more than 20 years' industrial experience in integrated circuits designs gained from Marconi Defence Systems, LSI Logic, Micron Technology Inc., and more recently worked as a Technical Lead, with Cambridge Semiconductor Ltd. (CamSemi), from early stage of the company start-up until a very successful first product launch.
    Jim Patterson
    Quality Director
    Jim Patterson has worked in Quality roles within the semiconductor industry for more than 30 years. This has included working at IDMs such as Filtronic (GaAs semiconductors) and GEC Plessey Semiconductors and finally a period of 7 years at the fabless semiconductor company, Cambridge Silicon Radio. Over this time, Jim has had responsibilities associated with all aspects of the Quality role including implementation and maintenance of ISO9001 management systems, supplier quality management, within a fabless manufacturing environment and product reliability ownership.
    Jess Brown
    Sales & Marketing Director - Industrial
    Jess Brown has over 20 years’ experience in the semiconductor industry having been involved in multiple areas including research, applications, regional marketing, business development, product line management and sales. Having a strong technical background combined with excellent commercial understanding, he has a proven track record of driving development, company strategy and directing multi-disciplinary teams to deliver state-of-the-art products. Extensive knowledge of the complete product development cycle with a proven track record in growing product revenue at companies such as Intelligent Energy, Wolfson Microelectronics, Volterra Semiconductor and Vishay-Siliconix.
    Sean Dixon
    Programme Director
    Sean has over 20 years’ experience working with advanced technologies, predominantly in project and programme leadership roles in leading edge companies in and around Cambridge, spanning product design and fabless semiconductor businesses. Previous companies include Nujira, Frontier Silicon, SiGe Semiconductor and Symbionics.



    Very impressive?

    QUIK, can you get these guys onto your silicon, and then help them with the partitioning of the algos....it might seem like sci-fi, but this is where the hardcoded engines of Eos 3 lie, this IS the form they are in. If its ubiquitous in a mobile device it becomes a future engine.
    THat for me is how the risk is getting taken out of this investment. QUIK takes NO risk in trying to anticipate ubiqity. Maybe its a Cambridge CMOS sensor in package? I think it may well be.

    I would already enjoy owning a small part of this business, very gratifying.
    If you have $$ to invest, where better to put them? This is it for me.

    everybody has their own subjective probabilities, but they do change every day, wk, and month, so please recalulate them frequently.
     

Sunday, October 25, 2015

  1. jfieb

    jfiebMember

    New
    ANyone hungry at lunch time in Scottdale please go here....thanks in advance.



    The food will be good, but the presentation will make it go down really,really nice.

    What lunch you ask?

    Its this one


    [​IMG]









    Tim Saxe Topic Table


    Designing Wearable Technology for Maximum Flexibility, Performance, and Power Efficiency

    Moderated by Tim Saxe, Chief Technology Officer, QuickLogic

    A key challenge for software and hardware designers of wearable electronics is to provide advanced processing capabilities in a small form factor while minimizing power consumption. Given that wearable technology is still an emerging market, it is also critical that developers maintain flexibility to meet changing market needs. For example, devices must be able to support advanced signal processing capabilities to reliably extract sensor data from low level signals in noisy environments. Devices must also be able to adapt to new types of peripherals such as motion sensors woven into clothing as well as implement increasingly sophisticated algorithms that can determine, for example, whether a person is running, bicycling, or cross-training. This session will discuss the use of hybrid device architectures and explore how developers can combine software programmability with application-specific accelerators and reconfigurable hardware to achieve the performance, power efficiency, and integrated functionality needed to enable next-generation devices ranging from low-end activity monitors to high-end sports watches.

    If anyonbe in the forum is at this great confab, please check it out for us.
    THanks in advance.

    That Dr. Saxe, he in demand now.
     
  2. jfieb

    jfiebMember

    So many lunches, so little time

    Always On MEMS 24/7

    Moderated by Will Tu, Director of Embedded Software, ARM

    Today MEMs and sensor devices are thought to be the key differentiators for IoT. The belief is that Moore’s law is nearing its end and now More than Moore’s law is taking over. We have heard the terms such as contextual awareness, prognostic system maintenance, and layer intelligence when talking about IoT, but what enables these devices to come to life is digital processing. Perhaps Moore’s Law is reaching an asymptote of diminishing returns, but computing is still need to provide edge processing and communication for these sensor networks. In fact, we want our sensor devices to be on 24/7, this idea of Always-on changes the expectation of low-power. Why should we be inconvenienced to have to activate our vehicle voice recognition with a push of a button, why can we not simply talk to the car and have it “listen” to us at all times, to know when we are wishing to talk to the vehicle? Wearable medical devices are always-on, our body has many involuntary functions that don’t stop when we go to sleep, and similarly technology needs to support us 24/7. Digital processing needs ultra-low power capabilities to support the always on requirement of the future.
     
  3. jfieb

    jfiebMember

    New
    The format?

    “Topic Table” Luncheon
    Thursday, November 6, 2014 | 11:45 AM – 1:00 PM

    The MEMS Executive Congress US 2014 “Topic Table” networking lunch provides a relaxed setting for attendees to share their knowledge and insights on the most relevant topics in MEMS commercialization today. By signing up for Thursday’s “Topic Table” lunch session, you can join this unique, intimate setting to discuss, debate, and share knowledge on pre-selected hot topics in the MEMS industry. Each table will be chaired by industry experts who will help guide and facilitate these focused gatherings of like-minded professionals. This year, we encourage you to maximize your time by joining more than one topic table. You will have the option to register for two separate topic table discussions. Your first choice, will take place during the first half of lunch and then you will move to the table of your second choice during dessert! Please note: Topic Tables are limited to only 12 attendees per table; registration is on a first come, first serve registration basis. If you are interested in joining a topic table, please indicate so during registration. The option to not participate in a topic table is also available

    So I would go to the 2 I have listed here, the one with Dr. Saxe and the one of 24/7.


  1. As things move forward and QUIK unveils the wearable Eos platform. I wanted to read this again…




    [​IMG]

    August 4, 2015

    SoC Everywhere
    Is the Future All One Thing?
    by Kevin Morris

    Sometimes, while wrapped up in the day-to-day minutia of technology trends, we can lose sight of the big, slow movements. Underneath the fast-paced, frenetic world of next-node Moore’s Law chaos are some giant trendline tectonic plates - slowly sliding, shifting along fault lines that are barely visible in our normal tech lives.

    Let’s fire up our future-facing seismometers and see what electronic bastions are poised to slide off into the ocean when the next “big one” hits.

    For the past thirty years, there has been extreme diversity in chips and in chip makers. We have processor companies making processors, of course; memory companies, microcontroller companies, FPGA companies, analog companies, RF companies, interface companies - every specialized type of chip hosts a mini-market of semiconductor specialists, competing for points of market share in their own little tightly-walled technology arena.

    Intel squares off against the likes of AMD. Xilinx and Altera feud like the Hatfields and McCoys, Linear Technology, Texas Instruments, and ADI spar with each other in the analog world. Samsung, Micron, and others dominate the memory game. Each of these contests exists almost in a bubble, oblivious to the gyrations in the adjoining market spaces.

    Deep down below the surface, however, Moore’s Law pushes the forces of integration and consolidation forward, gradually stressing the landscape above. The poster child for this movement is the never-more-appropriately-named “System on Chip” (SoC). We started calling chips SoCs before we had any right to. As soon as we could put a processor and - just about anything else - on a single chip, we called it a “System.”

    Now, however, SoCs are starting to actually deserve the label. SoCs from Xilinx and Altera can have numerous 64-bit applications processors, graphics processors, MPUs, memory, FPGA fabric, non-volatile storage, high-speed IO, and even a little analog - all on one device. 3D packaging techniques promise to make this type of integration go even farther - with the potential to put silicon from completely different processes on the same interposer. It’s not inconceivable that we’d have RF, analog, heterogeneous processors, digital logic, memory, non-volatile storage, high-speed IO, and even MEMS - all in one package or on one silicon interposer.

    If you look at the various specialized silicon vendors, you’ll start to notice that - at some level - almost all of them are now producing SoCs. We may be heading for a time when there is only an “SoC” market, rather than a fragmented collection of specialized silicon vendors. What we might see, then, is a re-partitioning of the market - into the application areas served, rather than the type of chip architecture being delivered. Automotive systems engineers would get their SoCs from one vendor, telecommunications and networking from another, and cloud computing from yet another. While the silicon will still be differentiated, the primary way that companies will need to compete will be on the things surrounding the silicon - support, reference designs, development boards, hardware and software development tools, IP, and so forth.

    If we look at the trajectories of the various elements, we can divine even more. For example, random logic is becoming essentially free. You can put multiple applications processors, MCUs, graphics engines, DSP processors, and other types of specialized processing elements on your chip for virtually no incremental cost in silicon area. So - why wouldn’t everybody throw them in? Even FPGA fabric is headed down the curve toward zero cost in silicon area. You can put more FPGA fabric than most applications could use on a chip for very little incremental cost.

    Memory is a different story. Today’s applications have a voracious appetite for memory, and it looks like it will be a long time (or never) before “more memory than you will probably use” will be small and cheap enough to throw onto every chip. As Moore’s Law progresses, and we put as much of the non-memory gunk on our chip as anyone could want, we’ll probably use the rest of the space for memory.

    By the same token, IO does not follow the curve of Moore’s Law. The amount we spend to route a single signal from our chip to a board hasn’t dropped all that much, and our appetite for more IO pins has grown rapidly, although not nearly at a Moore’s Law pace (thank goodness, or we’d have devices with a billion pins by now). The pace of increased integration helps offset the pin glut, however, as the more signals we can route between connected blocks inside our chip or module, the fewer we have to bring out to the real world on our board. 

    Following these three trends, we can visualize ending up in a world where processing and logic are basically free and ubiquitous, analog is present in sufficient quantities on most devices, memory is a commodity, and IO pins are at a premium. Even using the rules of that world, we could end up with far fewer different chips than we have today. A small number of different SoCs could be adapted to solve a huge variety of problems in a wide range of applications. The people buying those SoCs would be much less interested in the hardware and its capabilities than in the software, support, and application-readiness of the ecosystem surrounding the SOCs.

    If the world of chips may become less diverse and specialized, the world of applications continues to expand. That means that opportunities for “silicon” companies could be much more related to their ability to understand and serve particular applications than to their ability to build differentiated chips. Look for silicon vendors to spend more time understanding your actual challenges and less time bragging about how their max DSP performance is umpty-gazillion teraFLOPs and their power consumption is “3x lower” than their nearest competitor.

    In this world, software IP will also take on a very important role. If the chips are not particularly differentiated, and the development tools are fairly similar from different vendors, the way to your heart will be with software stacks and reference designs that do a lot of your grunt work for you. In that world, you may just have to grab the dev kit and start work right away on your magic secret software sauce. The rest may already be done.


    So this was written before we had reading material on Eos, but it fits very, very well into this essay.

    1.Its an SoC, not a fusion module ( INVN so far).

    2. Look for silicon vendors to spend more time understanding your actual challenges and less time bragging about how their max DSP performance is

    software IP will also take on a very important role.umpty-gazillion teraFLOPs and their power consumption is “3x lower” than their nearest competitor.



    Makes the move to talented algo chefs at QUIK so important. Many of the MCU folks will have a weakness here.



    Use this essay and the material we already have, with more material and news items to read yet this yr.
    Consider a mind shift soon, that QUIK IS not behind, leapfrogged, but just the opposite…

    they have a SoC, they have software IP, if its ubiquitous they will hard code a new engine in the roadmap with no risk to its acceptance ( it ubiquitous)

    Subjective probabilities ( Bayesian analysis) of success are shifting.