Saturday, October 4, 2014

Will look at Bosch ASSN( Application Specific Sensor Nodes

Name: BNO055

The BNO055 is the first in a new family of Application Specific Sensor Nodes (ASSN) that implement a complete motion sensor solution, including all sensors and sensor hub functionality, in a single package.

The BNO055 integrates a 14-bit accelerometer, a 16-bit gyroscope, a geomagnetic sensor and a SAMD20 microcontroller running Bosch Sensortec sensor fusion software.

It is the smallest solution on the market with a footprint of 5.2 x 3.8 x 1.1mm² and the first all-in-one Windows® 8.1 compatible sensor hub.

Software is an integral part of the delivered solution. It ensures the optimal system performance and eliminates the need for third-party software integration.

So they use an Atmel M0+ for the sesnor hub...

http://www.bosch-sensortec.com/en/homepage/products_3/9_axis_sensors_5/sensor_hub/sensor_hub_1

QUIK could do a much better job at this than the SAMD20. a LOT lower power, faster.
Will track along.

Global Foundries

http://www.globalfoundries.com/home

LPe

leverages GLOBALFOUNDRIES’ 65nm LPe (low-power enhanced) technology, which uses innovative leakage reduction techniques to significantly improve power utilization and extend battery life, making it especially well-suited for battery-operated and cost-sensitive mobile applications. The S2 Sensor Hub is expected to be production-certified in Q4 2014.

Maybe I expected a smaller trace width so that the areas of the S2 would be even less than it is, but consider this snip...

http://electronicdesign.com/digital-ics/understanding-28-nm-soc-design-arm-based-cores

n 28-nm designs, leakage power becomes more of an issue compared to previous nodes. This is due to thinner gate oxides, as well as more electron leakage between the drain and source of transistors. Especially in mobile applications, excessive leakage power has the potential to kill a project if not handled well.

So they have chosen something with yrs of experience, ie it works and if you go too far to the edge
other issues might crop up that would cause serious potential problems (?)...................

from the archives

In September 2009, it was announced that Chartered Semiconductor was about to be acquired by the main stockholder of GlobalFoundries,

Chartered Begins Production Ramp of Enhanced 65nm Low-Power Process; Improves Power Utilization by 30-50 Percent

65nm LPe Process Reduces Leakage (Ioff) by 20x, Extending Battery Life in High-Volume Mobile Applications

July 13, 2009 07:30 AM Eastern Daylight Time

SINGAPORE--(BUSINESS WIRE)--Chartered Semiconductor Manufacturing (Nasdaq:CHRT) and (SGX:CHARTEREDSC), one of the world’s top dedicated foundries, today announced the general availability of an enhanced version of its 65-nanometer (nm) low-power (LP) process, called 65nm LPe. The 65nm LPe process utilizes innovative leakage-reduction techniques to significantly improve system-on-chip (SoC) standby power consumption by up to 50 percent. The result is a lower-power process especially suited for battery-operated and cost-sensitive mobile applications that require active standby conditions, such as mobile handsets, multimedia players or personal internet devices. The process is also supported by a robust range of IP specifically optimized for the lower leakage capabilities.

“We have worked closely with Chartered to optimize our SiWare™ Memory and SiWare™ Logic solutions to their 65nm LPe process to meet our mutual customers’ SoC requirements”

Chartered is also offering an optimized RF platform solution based on the 65nm LPe process that combines RF physical design kits, broad IP support and a collaborative development system with its partners from the Wireless SoC Platform Alliance (WISPA) consortium. (See additional press release from July 13, 2009: “Chartered Offers 65nm RF Platform To Enable Single-Chip Wireless Applications”).

The 65nm LPe process significantly improves the performance-to-leakage ratio (Ion/Ioff) within the process’ pMOSFET. Given the same Ion (uA/um), the Ioff current is reduced by a magnitude of 20X. This directly impacts the battery life of mobile applications as this leakage improvement is observable in both active and standby situations. In cases where a product operates in long standby situations such as a mobile phone, improvement in the standby power consumption can be as great as 15-25 percent, depending on the application.

A full suite of IP is available for the new process from leading suppliers, including Analog Bits, Aragio Solutions, ARM, Cosmic Circuits, Denali, Synopsys, True Circuits and Virage Logic. The support includes analog front end (AFE), audio codecs, standard interfaces and a range of level physical IP libraries and memory compilers that have been specifically tuned to take advantage of the enhanced leakage capabilities of the process.

“ARM is pleased to expand our long standing relationship with Chartered by offering a full complement of physical IP optimized for Chartered 65LPe process,” said Simon Segars, executive vice president and general manager PIPD division, ARM. “This rich platform of IP includes enhanced memories and logic targeted at improving the performance of ARM processors. All products are supported by the most advanced power management EDA views. We believe this combination of 65LPe process and ARM physical IP is well suited to a range of mainstream applications where leakage optimization is paramount. Through the sponsorship of Chartered, the libraries are free and available today athttp://designstart.arm.com.”

“We have worked closely with Chartered to optimize our SiWare™ Memory and SiWare™ Logic solutions to their 65nm LPe process to meet our mutual customers’ SoC requirements,” said Brani Buric, vice president of marketing and sales at Virage Logic. “With a comprehensive dashboard of options, the SiWare product line provides the flexibility needed to efficiently manage design tradeoffs to meet low power as well as performance design requirements.”

Chartered’s enhanced 65nm LPe process features a core 25 angstrom transistor oxide with three voltage options (Standard Vt, Low Vt, High Vt). The High Vt option offers the lowest leakage at 0.01nA/um and 0.007nA/um for the NMOS and PMOS transistors, respectively. Two thick gate oxides are available: a 32A device for 1.8V; and a flexible, IP-enabled 2.5V 52A device that is also useable for 1.8V and 3.3V applications by varying the channel length. The back end of line (BEOL) metal implementation supports up to nine layers of copper to optimize die size and routing efficiency. Manufactured on rotated substrates, the 65LPe process benefits from an increase in the pMOSFET hole mobility and saturation velocity without detrimentally affecting the nMOSFET.

“Today’s high-volume mobile applications require highly optimized silicon solutions that operate in an extremely power-efficient manner, but don’t compromise performance or functionality,” said Brian Klene, vice president, product marketing at Chartered. “Our 65nm LPe process has been developed specifically with extended battery life in mind, with optimizations made to the process itself and our ecosystem of design support to improve efficiency significantly. The 65nm LPe process is a full-featured and flexible platform on which a wide variety of wireless, mobile and multimedia products can be base

In early Nov.,

Agenda

Agenda is tentative and subject to change.

Wednesday, November 5, 2014
6:00 pm – 7:00 pm	MIG New Member Soiree
7:00 pm – 8:30 pm	Registration Opens, Welcome Dessert Reception & Cocktail Party
Thursday, November 6, 2014
7:00 am- 8:00 am	Breakfast
7:30 am – 5:00 pm	Registration
8:00 am – 8:30 am	Welcome and MIG Update, Karen Lightman, Executive Director of MEMS Industry Group
8:30 am – 9:15 am	The Next Big Thing: George Liu, Director of Corporate Development at Taiwan Semiconductor Manufacturing Company (TSMC) Morning Keynote Intro by EV Group, Platinum Sponsor
9:15 am – 9:45 am	Managing the Challenges of Introducing MEMS into a Healthcare Product Line: Tim Nustad, General Manager and Chief Technology Officer, MR Healthcare System
9:45 am – 10:15 am	Coffee Break (sponsored by SunEdison)
10:15 am – 10:45 am	The Paradigm Shift of the Internet of Things and its Impact on and in the MEMS and Sensors Industry: Chris Wasden, ‎Professor of Innovation & Executive Director of the Sorenson Center for Discovery and Innovation at University of Utah
10:45 am – 11:45 am	MEMS Technology Showcase
11:45 am – 1:30 pm	Lunch Topic Tables Luncheon
1:30 pm – 2:00 pm	Security Imperative: How to Build Stronger Security Requirements into the Design Phase of Product Development: Nate Kube, CTO, Wurldtech
2:30 pm – 3:00pm	MEMS Microspectrometers – Powering New Sensing Applications: Anna Rissanen, Research Team Leader, MOEMS and BioMEMS Instruments, VTT
3:00 pm – 3:30 pm	Coffee Break (Sponsored by Okmetic)
3:30 pm – 4:30 pm	MEMS in Healthcare Panel Discussion: Mark Winter, CEO, CareSpan USA (Sponsored by Tronics)Panelists include: Steve Whalley, Chief Strategy Officer, MEMS Industry Group Anita Goel, MD-PhD, Chairman and CEO, Nanobiosym; Physicist, Harvard-MIT Anna Barker, Co-Director, Complex Adaptive Systems & Director, National Biomarker Development Alliance, Arizona State University Kathy Mackey, Principal, Ascent Synergy Solutions
4:30 pm – 5:30pm	Elevator Pitch Session and Wrap-up for Day
6:00 pm – 8:00 pm	MEMS Executive Congress Networking Dinner – Cowboy BBQ, Mummy Mountain
8:00pm – 9:30 pm	Post Dinner Networking Cocktail Hour (Sponsored by Coventor)
Friday, November 7, 2014
7:30 am – 9:15 am	Registration
7:00 am – 8:00 am	Breakfast
8:00 am – 8:15 am	Brief Update and Welcome, Karen Lightman, Executive Director of MEMS Industry Group
8:15 am – 8:45 am	An Academic View of the MEMS Industry in 2014: Technologies, Trends and Talent: Tom Kenny, Professor of Mechanical Engineering at Stanford University
8:45 am – 9:45 am	MEMS Market Spotlight Panel Discussion: Rob O’Reilly, Senior Technical Advisor, Analog Devices Panelists include: Jean-Christophe Eloy, President & CEO, Yole Developpement Jeremie Bouchaud, Director & Senior Principal Analyst, IHS
9:45 am – 10:15 am	Coffee Break
10:15 am – 10:45 am	MoboSens -Smartphone Micro Sensor for Accurate and Quantitative Environmental Water Analysis: Manas Gartia, Scientific Research Officer, MoboSens
10:45 am – 11: 30 am	Getting to a Trillion Sensors: Why MEMS Engineers Have to Become Ecosystem Co-creators Francis Gouillart, CEO, Experience Co-Creation Partnership
11:30 am – 12:00 pm	Closing Thoughts & MEMSies Awards, Karen Lightman, Executive Director of MEMS Industry Group
1:00pm -3:00 pm	Social Event (Golf or Other Alternative Event- TBD)

Thursday, October 2, 2014

I will do some work on todays news item...

Oct 2, 2014

Previous Release

PDF

Add to Briefcase

QuickLogic Launches Qualified Vendor List Program for Sensor Hub Platforms

SUNNYVALE, CA -- (Marketwired) -- 10/02/14 --

Ensures known-good-interface with inertial, photonic, environmental, and wellness sensors from popular manufacturers
Compatibility ensures a quick design-in with proven device drivers

QuickLogic Corporation (NASDAQ: QUIK), the innovator of ultra-low power programmable Customer Specific Standard Products (CSSPs), today announced that it has implemented a formal Qualified Vendor List (QVL) program for sensor hub platforms. The initial QVL includes a variety of sensor models and types from AMS, Analog Devices, Bosch, InvenSense, Kionix, Murata, STMicroelectronics, and others.

The QVL program streamlines the design process for OEMs and empowers them with confidence in choosing sensors that have been pre-qualified by QuickLogic. This pre-qualification includes verifying communication and compatibility with all relevant blocks and functions within QuickLogic'ssensor hub platforms. Since QuickLogic has already developed and tested device drivers and algorithms for each of the sensors, OEMs can expect their development and integration efforts to be fast, efficient and seamless. With this qualification, and QuickLogic's development platform, OEMs can also "fine tune" designs to optimize system level performance.

"With assurance of system-level compatibility, QuickLogic's QVL program allows OEMs to accelerate product development, lower costs and reduce risks," said Paul Karazuba, director of marketing and media at QuickLogic. "While we have already qualified a wide variety of sensors from the leading suppliers in the market today, we will continue to expand our QVL by adding new sensor models, types, and manufacturers."

QuickLogic's ArcticLink 3 S2 sensor hub platform provides OEMs with a complete solution that includes the programmable CSSP device, proven Android or RTOS software drivers, and sensor algorithms for user transport, activity, gesture, and context determination. OEMs can choose to use off-the-shelf catalog solutions or can fully customize the design with QuickLogic's Integrated Design Environment (IDE) tools. With QuickLogic'sIDE tool, OEMs can easily incorporate internally-developed IP and algorithms to the ArcticLink 3 S2 sensor hub platform with confidence of maintaining forward compatibility to future roadmap devices.

In the subjective probabilites game I just look for incremental tidbits to add the the known information. So what has changed...

some new phrases....

environmental, and wellness

a new sensor name

, Kionix,

first I will work on environmental...

Apple envisions environmental sensors for wearables

Two patent applications describe environmental and temperature sensors that could be outfitted into "wrist-watch devices" as well as other wearable gadgets.

by Lance Whitney

@lancewhit
April 24, 2014 9:36 AM PDT

A couple of patent filings envision two features that could pop up in a future iPhone as well as the much-rumored Apple iWatch.

Published Thursday by the US Patent and Trademark Office, "Electronic Devices With Environmental Sensors" and "Electronic Devices With Temperature Sensors" both highlight specific types of sensors designed for electronic devices. Those devices include computers and gaming equipment as well as cellular phones, wrist-watch devices, and pendant devices.

The first patent application discusses environmental sensors that could check the outside temperature, pressure, humidity, and other factors. The sensors might also tap into a microphone to measure sound.

So if its these, and not say Carbon monoxide..it fits right into the same idea as was on the Bosch sensor roadmap ( axis +3) PTH,

http://semiconchina.org/downloadFile/1397118708392.pdf

so maybe the three go together on one die or get put together....use this as a mental model

Bosch North America
Bosch Sensortec’s BME280 Sensor Combines Pressure, Humidity and Temperature Measurement
High accuracy and versatility, very small footprint
- Fastest temperature and humidity measurement in the market - Supports many emerging smartphone applications such as home automation control and innovative sport and fitness use cases - Adds floor level tracking to indoor navigation So if you do 9 axis +3 you get indoor location also....nice. Bosch Sensortec announces a world first in sensor technology: the BME280 Integrated Environmental Unit combines sensors for pressure, humidity and temperature in a single package. This unique sensor has been developed to support a broad range of emerging high performance applications such as indoor navigation, home automation control, personalized weather stations and innovative sport and fitness applications. The precise altitude measurement function of the BME280 is a key requirement in applications such as indoor navigation with floor tracking where exceptional accuracy, low temperature drift and high resolution are needed. Additionally, the BME280 has a best-in-class response time of just one second for humidity determination, excellent ambient temperature measurement and low energy consumption. More precise measurement at lowest power consumption With a small footprint of just 2.5 x 2.5 mm2 and a height of 0.93 mm in a space-saving 8-pin LGA package, the sensor offers high design flexibility and is ideally suited for mobile devices with limited space such as smartphones, tablets, smart watches and electronic wristbands. Very low current consumption of only 3.6 µA (at 1 Hz) makes the BME280 Integrated Environmental Unit particularly suitable for battery-driven applications. Three power modes and separately configurable oversampling rates for pressure and temperature measurements allow designers to adapt the BME280 to a wide range of use cases. The humidity sensor within the Integrated Environmental Unit measures relative humidity (0% to 100%) across a wide temperature range from -40°C to +85°C with a fast response time of less than 1 second. The humidity measurement accuracy is ±3% with a hysteresis of 2% or better, and the temperature reading accuracy is within 0.5°C. The BME280 offers excellent overall precision. The relative accuracy of pressure readings is ±0.12 hPA, which equates to ±1 m (3.28 ft) of altitude difference at a resolution of 1.5 cm (0.59 inches). As a result, the BME280 is ideal for enhanced high performance GPS applications where it can be used to achieve more precise and faster position determination. BME280 pressure measurement is very stable over temperature: The low temperature coefficient of 1.5 Pa/K, translates into an altitude stability over temperature measure of 12.6 cm/K (5.0 inches/K). This precision, along with its versatility and compactness, makes the BME280 ideal not only for innovative new applications but also to improve the exactness of existing ones. A few examples: the sensor can be used to implement indoor climate control applications for smartphones; it allows altitude profiling to be integrated into sports applications, enabling better training performance monitoring, and much more. As a connected sensor in the Internet of Things, the BME280 enables a host of further applications in home automation, smart energy, smart transportation and elderly care. Bosch Sensortec also provides support software. The BSH1.0 algorithm enables developers to implement a precise temperature compensation function. First samples of the BME280 to key development customers are available now. Features and properties Relative humidity range: 0 to 100 % at temperatures from -40°C to +85°C Response time for humidity measurements: 1s Humidity accuracy tolerance: ± 3 % relative humidity Hysteresis: ≤ 2 % relative humidity Pressure range: 300 to 1100 hPa Absolute pressure accuracy: typ ± 1hPa after soldering Absolute temperature accuracy ±0.5°C at 25°C Communication interfaces: I2C, SPI Bosch Sensortec GmbH is a fully owned subsidiary of Robert Bosch GmbH. It develops and markets micro-mechanical sensors for consumer electronics, mobile phones, safety systems, industrial technology and logistics. The product portfolio includes triaxial geomagnetic and acceleration sensors, triaxial gyroscopes, barometric pressure sensors and a comprehensive software portfolio for various applications. Since its foundation in 2005 Bosch Sensortec emerged as the technology leader in the addressed markets. The Bosch Group has been the global market leader for MEMS sensors since 1998 and has to date sold more than 3 billion MEMS sensors.

ie 12 axis the same number the S2 can do....

The second application focuses more on temperature sensors in the form of a thermometer mounted into a button on the device. Those sensors would then measure anything that comes into contact with the button, whether it's the surrounding air to detect the outside temperature or your own finger to detect your body's temperature.

Last month, a Chinese analyst claimed that the iPhone 6 could come with its own barometer to detect the temperature, humidity, and air pressure. Reports have also suggested that Apple's rumored iWatchwould be able to track a user's health and fitness through an iOS 8 app called Healthbook.

Tuesday, September 30, 2014

Take the time to go through this slide deck...

http://semiconchina.org/downloadFile/1397118708392.pdf

The MEMS sensor integration path
Shanghai, 19th of March 2014
Leopold Beer, Regional President Asia Pacific

great stuff in it.

As far as M & A activity this slide deck says a lot more is going to happen to put the right bits and pieces much closer together. That includes the sensor makers.............as the SoC are built.

QUIK has the bits and pieces to make the BEST SoC that there will be.

the snip from the new opening

BS/MS in Electronics Engineering with 7-10 years of experience in SOC new product introduction.

SO Bosch calls this thing a Application Specific Sensor Nodes (ASSN).

Very sililar to the phrase that QUIK uses…Application solutions.

We have a catalog for context and gesture, expect one for 10 axis location when its done.

In the past we had a short lived & not so successful pairing of the VX with Taos light sesnor. A reference design with AMS for gesture, their gesture sesnor, our S2 and algos would make a lot of sense.

nice Bosch slidedeck is here

http://semiconchina.org/downloadFile/1397118708392.pdf

slide 7 look under “sensor clusters”

Sensor hubs
ASSN
SIP & SoC…..

slide 8
very important far right the 12 axis stuff( the same size as the S2)
12 axis for them is 9-axis + Pressure temp and humidy

slide 11 very important…it has functionality on the Y and power on the x…
note many IoT things( smart home) will be wired so they won’t care so much about the power of an MCU…

slide 15

take a look at that one…

What would be a good day?

Bosch adopts the QUIK S2/S3 for its future ASSN families across the board?

Thanks in advance for any efforts in this area QUIK.
Also for the same thing with AMS, others too.

Please help us understand the business that QUIK is in better than anyone..how
post questions, comments, news items..there is a LOT that can be done while
waiting for QUIK to say something rather than watch the price….

PS A new job will put QUIK at about 100 people.
What’s it for you ask?

BS/MS in Electronics Engineering with 7-10 years of experience in SOC new product introduction

QUIK HAS the bits and pieces to make the very BEST SoC that there is. ( the Bayesian inference that gets weighed )
If true who would make a better ASSN family for Bosch than QUIK?
Rick and Paul both mention the Roadmap and that some may be working with the various Ses, but only to be ready when
the intersection is there, for some the tiered S3- a FFE with an ARM core above it might be the one.
Use the Bosch items, the letters ASSN, to know they have a long term plan here for MCU/SoCs and their sensors.

Go QUIK, and take this slot. Thanks in advance for your efforts here.

The BNO055 is the first in a new family of Application Specific Sensor Nodes (ASSN) implementing an intelligent 9-axis

BNO055

“Absolute Orientation Sensor”, which includes sensors and sensor fusion in a single package.

The BNO055 is a System in Package (SiP), integrating a triaxial 14-bit accelerometer, a triaxial 16-bit gyroscope with a range of ±2000 degrees per second, a triaxial geomagnetic sensor and a 32-bit microcontroller running the company’s BSX3.0 FusionLib software. At just 5.2 x 3.8 x 1.1mm², it is significantly smaller than comparable discrete or system-on-board solutions.

By integrating sensors and sensor fusion in a single device, the BNO055 eases the integration process for customers, freeing them from the complexities of multivendor solutions so they can spend more time on product innovation, including novel applications such as wearable hardware. It is also the perfect choice for augmented reality, more immersive gaming, personal health and fitness, indoor navigation and any other application requiring context awareness.

Monday, September 29, 2014

when QUIK has filled all the current job openings we will crack 100.(there about)

Here is the new one, for future reference, ie when its gone..again they are adding another 100 man yrs of experience.

SENIOR STAFF PRODUCT TEST ENGINEER

Sunnyvale, CA

JOB DESCRIPTION

The staff/senior staff Product Engineer will be a key team member of Product Engineering team, responsible for new product introduction of QuickLogic’s SoC (System on Chip). The position reports to the Director of Product development and the role holder is expected to define design for test requirements, develop and implement verification and characterization plans, develop and implement qualification plans, as well as work with manufacturing to improve product cost margin and quality. Strong semiconductor product characterization and test background and the ability to collaborate with multiple engineering disciplines at different geographical location worldwide are essential to the success of this position.

Key result areas for this position are:

Develop and implement plans for product verification and characterization
Validate and characterize prototype and corner materials, functions, and datasheet specifications including
Bring up validation test boards and bench test set-up, design special jigs for characterization, and debug hardware issues
Develop characterization designs for timing measurements in RTL.
Develop ATE programs for device verification, characterization, and qualification.
Provide technical assistance in identifying and resolving customer problems, developing new tests, and improving efficiency and effectiveness of existing tests
Partner with Design Engineering in defining effective test methodology for all QuickLogic new products during product definition
Partner with Test Engineering on ATE test program development, test flow, and knowledge transfer
Partner with Reliability in defining qualification requirement and execution and with Manufacturing to improve product’s cost and quality
Ensure new product introduction is successful and on schedule by collaborating with a global cross-functional team

Key Activities/Tasks for these positions are:

Develop and implement plans for silicon validation and characterization
Characterize device across PVT to set up maverick limits and datasheet specs
Develop characterization designs for timing characterization using Verilog/VHDL
Design, simulate and convert functional patterns to verify functions on ATE and bench
Validate functionalities at the component level in a system level environment
Collaborate and execute qualification plan during new product introduction
Develop reliability functional tests for HTOL
Failure analysis of devices in system level and work with various technical leads to identify root cause
Work with Test Engineering to develop test flow to ensure overall test coverage of new and current products
Active participant in initial test vector bring up
Work with Test Engineering on test optimization to minimize test time and assist in identifying and resolving test related activities

QUALIFICATIONS

BS/MS in Electronics Engineering with 7-10 years of experience in SOC new product introduction.
Experience in reliability and characterization of semiconductor devices.
Knowledge of ASIC and FPGA design methodology.
Knowledge of Verilog/VHDL is a must
Knowledge of simulator tool such as ModelSim is a must
Knowledge of ATE testing and methodology is a must.
Experience in custom design test methodology, preferably programmable logic devices (PLD or FPGA).
Knowledge of programming language is a must (C or C++).
Working knowledge of scripting language like Perl.
Excellent communication skills, both in written and verbal form.
Prior experience working with multi-site, multi-cultural teams.

So I was just working on SoC and this new job will be working on that also. So it will be testing of the current S2 with and ARM M4 above it on one die.

I will work with this snip from the ARM 7 news item...

The rising performance of MCUs
Generally, though, there is a trend for more performance at the edge, so the challenge is to bring 8-bit power efficiency levels to bigger architectures. To the delight of chipmakers, the IoT is re-placing one chip with several in many instances – for instance, an Cortex-M0+ sensor hub coupled with a Cortex-M4 or –M7 doing the apps processing.

My commentary

note the 2 ARM core chips in the underlined text…M0+ for a sensor hub, next tier up they want an M4 or 7 for higher level fusion. QUIK is going to do the same thing…only much better.

Why much better you ask?

The M0+ has NO math unit for Kalmans of sesnor fusion. while the smallest of the ARM cores the power savings over the M4 are very minimal, I looked it up, and don’t have the exact numbers, its a LOT less than you would think, ie GOOD for QUIK, as they will put the huge power saving of the FFE with its math unit in front of the M4 or M7, ( will they do both one day? ;-)). In the above they use the phrase…re-placing one chip with several

QUIK will not only do it better, but it will also be a SoC. one chip, less real estate used up etc.

What will the others do?

They will just put those 2 cores together to make an SoC. The M0+ with an M4/M7. Little and big.

This is where the other part of the name of this blog comes in...Steven Johnson's "adjacent possible". What will the others do?

They will just put those 2 cores together to make an SoC. The M0+ with an M4/M7. Little and big. It the bits and pieces that they have so they will stick them together...like this one from NXP archives

NXP’s New Dual-Core Cortex-M4 and M0 MCU Redefines Digital Signal Control

November 01, 2010

LPC4000 family’s unique configurable peripheral subsystem allows developers to tailor MCU and DSP solutions

Eindhoven, Netherlands and San Jose, California, November 1, 2010 – NXP Semiconductors N.V. (Nasdaq: NXPI) today announced the LPC4000 family, the world’s first asymmetrical dual-core digital signal controller architecture featuring ARM® Cortex™-M4 and Cortex-M0 processors. The LPC4000 brings the advantage of developing DSP and MCU applications within a single architecture and development environment. With this dual-core architecture and a set of unique configurable peripherals, the LPC4000 enables customers to develop a wide range of applications such as motor control, power management, industrial automation, robotics, medical, automotive accessories and embedded audio. NXP will be showcasing the LPC4000 simultaneously at electronica 2010 in Munich, Germany from November 9 to 12, and at ARM TechCon, Santa Clara, California, from November 9 to 11.

“The LPC4000 is not just another Cortex-M4. We’re introducing multi-core processing to microcontroller and DSP applications,” said Geoff Lees, vice president and general manager, microcontroller product line, NXP Semiconductors. “Equally important are the configurable peripherals that enable LPC4000 users to reduce the need for external ASIC functionality.”

”

QUIK bits and pieces will be different...the next add on to the S2 + and M4/7. QUIK has the bits and pieces to make the VERY BEST SoC there will be.

Audio processing may be big for wearables, audience uses DSPs, the M7 will be able to do this also?

QUIK, sensor hubs and the "adjacent possible"