13 Apr. 2017 SMIC Advanced Technology Workshop Shanghai, China

done
18 Apr. 2017 SMIC Advanced Technology Workshop Santa Clara, CA, US


yesterday and onward to

9 May. 2017 SMIC Advanced Technology Workshop Hsinchu, Taiwan



Hsinchu is a city in northern Taiwan, southwest of the capital city of Taipei. It’s known for its ornate Hsinchu City God (Cheng Huang) Temple, lined with food stalls. Close by is Yin Hsi East Gate, a 19th-century structure once used as an entrance to the city. Hsinchu Zoo houses hippos, Bengal tigers and Malay bears. Southeast of the center, trails cross the forested Shibajian (18 Peaks) Mountain.


QUIK is the traveling gnome of eFPGA?

As a part owner I like these sort of postcards!


 

This company is small, but very global, I like these tech road shows as a part owner A LOT more than I like those aimed at the street-like the Roth type ones: but .....to each there own,

1. jfieb, Wednesday at 5:55 AMEditDeleteReport

   #13Reply
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   jfiebWell-Known Member

   
   

   So consider that from 40 to 22 gives us 60% of new area...
   
   And then to 12 another 50% after that.
   
   So as a part owner of this business being on the RIGHT side of Moore's law is fun, the anxiety of watching an AP suck up the great Apical algo is banished thankfully for good. QUIK will add more engines toward that word heterogeneous computing. Only IF it is ubiquitous will it get hardened...
   
   A FEW APP companies are HUGE enough to have proprietary engines of their own?. say
   Flexible Facebook engine, to partition within the SoC.
   
   
   I also believe technologies / companies signed up for FDXelerator will be available on 12nm FDX too.
   
   
   
   Why do I reread this often?
   
   
   This week I am NOT looking at it from my small point of view, but pretending I am a Tier 1 MAJOR app company with a new product division who has a vision of the future... I WOULD NOT use anything that did NOT scale toward that horizon....
   
   Now QUIK CAN use 22 and then 12 to add a LOT of stuff ... the SoC for that ultimate vision can barely be glimpsed from the rooms that QUIK has just entered, after waiting a long time for the invite.
   
   Use any incremental info to let it sink in that QUIK IS worth a LOT more today than ever before.

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   AM happy with the info sifting work of today....the first time I have seen IN PRINT the highlighted part....I did expect it, but wanted something like this....
   
   Its in an item that speaks more of TSMC...the worlds largest foundry...
   
   http://www.eetimes.com/document.asp?doc_id=1331489
   
   TSMC has taped out nearly 800 chips using flavors of its 28nm process. It has shipped 4.5 million 28nm wafers to date, clearly a big sweet spot it aims to defend.
   
   Globalfoundries hopes to capture many of those customers starting this year with 22nm FD-SOI, a lower cost, lower power alternative with similar performance to TSMC’s 16nm FinFET node. TSMC claims its 22nm process provides an easier migration path from 28nm while FD-SOI requires redesigned intellectual property cores.
   
   “Bulk semiconductor technology has been enhanced for 30 years and is used by Intel and Samsung,” the world’s two largest chip makers, said Mark Liu, TSMC’s co-chief executive in a brief interview after a keynote here. “FD-SOI will always be the technology of the future,” he quipped.
   
   The news comes the same day NXP announced it will use FD-SOI for multiple future processors. So far, a total of just 10,000 FD-SOI wafers/month are shipping from all fabs including Globalfoundries and STMicroelectronics, said Sam Wang, a chip analyst for Gartner.
   
   Globalfoundries may be slightly ahead in timing, ramping its 22nm FD-SOI process now with Sony image sensors in production. TSMC said its 22nm process will be in production next year, aimed at 5G RF and other mobile chips including image processors and components for wearables and the Internet of Things.
   
   
   Note that also GLo FO is a good yr ahead of TSMC on this...?
   

   jfieb, 18 minutes agoEditDeleteReport

   #107Reply
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   jfiebWell-Known Member

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     In a phone interview with EE Times, Geoff Lees, general manager and senior vice president of microcontrollers, security and connectivity, told us NXP has gained full confidence in the low power, high efficiency and scalability FD-SOI technology can deliver. With FD-SOI, Lees said, “We can now target a variety of family of processors from a single [FD-SOI] process node.”
     
     The microprocessor product lines already transitioning to FD-SOI technology include NXP’s i.MX 7ULP family and the i.MX 8X family for automotive applications. Lees also noted that NXP is “seeing strong interest” in MCU-level products that are also based in this ultra-low power 28FD-SOI technology node. NXP, however, has not finalized launch timeframe with the lead customers or for broad-market introduction.

   
   So no mention of GLo FO so its good for FD-SOI, but dont know how the whole puzzle goes together. Samsung FDX?
   
   SO what is good..
   It's NXP moving BIG time to a technology that many do not know how it fits in- now they know. ANd its good as it is the tech. that Glo Fo has worked so hard on.
   
   Now the thought process for me has also shifted a little and this is just for FUN. FDX is doing good as NXP looks to IoT. ANyway I have added Samsung foundry to the list of the 2nd one?
   

    3 minutes agoEditDeleteReport

   #108Reply
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   jfiebWell-Known Member

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   So in the HUGE pic THIS is the important thing to be so happy about...
   
   PARIS – To do FD-SOI or not to do FD-SOI? NXP Semiconductors’ announcement this week at Embedded World in Nuremberg might finally put an end to this Shakespearean quandary, although there remain players in the chip industry unprepared to face the answer.
   
   *********
   
   he same day NXP announced it will use FD-SOI for multiple future processors.
   
   So any question of this technology and will it be a success-GONE, gone, gone.

   QUIKs adjacent possible- Using S Johnsons metaphor, the rooms that can be glimpsed through the door of the room eFPGA has allowed us to enter are grandin ways we can hardly imagine.,
   

on one page...

job opening...

ArcticPro eFPGA is being licensed by several Tier-1 customers for integration into their SoCs.

NXP Embraces 28nm FDSOI for MCUs

PARIS—NXP is set to extend the use of 28nm fully-depleted silicon-on-insulator (FDSOI) process technology down to its low-power LPC microcontrollers, according to Goeff Lees, newly installed as general manager of MCU business at NXP Semiconductors NV.

If NXP was in at 28...there was NO eMRAM...thwy should REALLY like 22 FDX!

Sign them up for eFPGA?

Oh already have?

NXPs MCU SoCs....Their adjacent possible is the 22FDX.  QUIKs Adjacent possible is this Tier 1, now going to QCOM...will track along.

1. vk11dd6, Thursday at 12:50 PMReport

   #62LikeReply

   wkav likes this.
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   jfiebWell-Known Member

   
   

   homework for me had to do with Glo Fo 22FDX memory as Dr Saxe mentioned it...
   
   
   GLOBALFOUNDRIES Launches Embedded MRAM on 22FDX® Platform
   Sep 15, 2016
   
   High-performance embedded non-volatile memory solution is ideally suited for emerging applications in advanced IoT and automotive
   
   Santa Clara, Calif., September 15, 2016-GLOBALFOUNDRIES today introduced a scalable, embedded magnetoresistive non-volatile memory technology (eMRAM) on its 22FDX platform, providing system designers with access to 1,000x faster write speeds and 1,000x more endurance than today’s non-volatile memory (NVM) offerings. 22FDX eMRAM also features the ability to retain data through 260°C solder reflow, industrial temperature operation, while maintaining an industry-leading eMRAM bitcell size.
   
   GF's eMRAM will be offered initially on its 22FDX platform, which leverages the industry’s first 22nm fully-depleted silicon-on-insulator (FD-SOI) technology. This versatile eMRAM technology is designed for both code storage (flash) and working memory (SRAM) to enable ultra-efficient memory sub-systems that can be power cycled without any energy or performance penalty. The power efficiency of FDX™ and eMRAM, coupled with the available RF connectivity IP, makes 22FDX an ideal platform for battery-powered IoT products and automotive MCUs.
   
   now with flexibility of eFPGA too, nice total package.....
   
   “Customers are looking for a high-performance non-volatile memory solution that expands their product capabilities," said Gregg Bartlett, senior vice president CMOS Platforms Business Unit, GF. "Our introduction of 22FDX eMRAM enables system designers with new capabilities, allowing them to build greater functionality into their MCUs and SoCs, while enhancing performance and power efficiency.”
   
   The emergence of autonomous vehicles is rapidly driving the need for increased on-chip memory capacities required for real-time vision processing, high-precision, continuous 3D mapping data and next-generation automotive MCUs that update over-the-air. GF's eMRAM uniquely addresses these advanced driving assistance system (ADAS) requirements by combining greater memory density than SRAM, with the fast write, very high endurance, and non-volatility that only magnetoresistive memory can provide.
   
   “Emerging non-volatile memories are moving from the lab to the fab,” said Thomas Coughlin, President of Coughlin Associates. “GF's 22FDX eMRAM will offer a major advancement in SoC capabilities, by leveraging the key performance attributes of embedded MRAM. Designers of battery powered IoT devices, automotive MCUs and SoCs and SSD storage controllers will certainly want to take advantage of this versatile embedded NVM technology.”
   
   The introduction of GF's 22FDX eMRAM is a result of the company’s multi-year partnership with MRAM pioneer, Everspin Technologies. The partnership has already delivered the world’s highest density ST-MRAM in August, 2016 – Everspin’s 256Mb DDR3 perpendicular magnetic tunnel junction (pMTJ) product, which is now successfully sampling and is being readied for mass production at GF.
   
   GF's 22FDX eMRAM is currently in development and is expected to be available for customer prototyping in 2017, with volume production in 2018. GF's eMRAM technology is scalable beyond 22nm and is expected to be available on both FinFET and future FDX platforms.
   
   so i learned something, but will read it a few more times