Thursday, December 4, 2014




PRESS RELEASE

2015 International CES to Feature Latest Innovations in Sensor Technology

Published: July 31, 2014 4:01 p.m. ET

CEA to partner with MEMS Industry Group to introduce new gesture and motion technology focused marketplace


ARLINGTON, Va., Jul 31, 2014 (BUSINESS WIRE) -- The Consumer Electronics Association (CEA)® today announced the Sensors Marketplace, presented by the MEMs Industry Group, a showcase of the latest innovations in gesture and motion technology, at the 2015 International CES®. Owned and produced by CEA, the International CES is the world’s gathering place for all who thrive on the business of consumer technologies. The 2015 CES is scheduled to run January 6-9, 2015, in Las Vegas, Nevada.




Misfit debuted a new (and more budget-friendly) activity tracker back in the fall, but the company has plans to tackle more than just wearables. The outfit will keeping working on its existing line of gadgets, but in the months to come, the connected home will garner attention as well -- in addition to some "advanced wearables" that move beyond those worn on the wrist. CEO Sonny Vu wasn't ready to offer up specifics, but he did note that a number of products in the household space were on tap for the immediate future. "If you actually have to wear something 24/7 to get data, it's kind of a disadvantage," Vu said during a chat with Re/code. "But if you can just buy something that you plug into the wall, and it works, it can really add value."
Until now, the company has done little outside of its fashionable trackers and companion app, with the exception of a co-branded Beddit sleep monitor. Misfit also nabbed $40 million in funding from Xiaomi which should help the wearable crew produce its products quicker. It'll also offer a hand with expansion in the Chinese market, on top of the aforementioned new product categories.


commentary?  OK here goes....

Consider the NXP model..waaay back in fall of '13...Of how the M7 was a special design done by NXP for Apple. Just for Apple.

There is ANOTHER new job up on QUIKs site, I will take just a snip of the text....general things like...

The candidate will work closely with a team of platform architects, SoC designers, hardware, software engineers and product engineers.


then in the key activities is this 

  • Help to review customer ULPSH schematic and provide guidance to insure customer design is optimized for power consumption.
  • Execute Device Power measurement during silicon validation.
  • Work with PE team to support and improve power measurements during manufacturing test.


So the adjacent possible says that for a few of THE MAJOR players we do like NXP did and spin a special version ULPSH with everything they want on it-just the way they want it?

That customer becomes the roadmap.  QUIK would NOT do this
for smaller players as they have catalog solutions for them.

But for the right BIG names OEM and a few AP makers maybe this is a good way to go?

Time will tell.  Either way its good and suggests that there is close participation of customers and what they want.  Its not build it and they will come ( LIke VEE)

Long time holders want some brand names, and items like this support the conclusion that they are coming.

AND CES will have the very nice presence of the MEMS  folks....

S-enabled products, featuring everything from gesture recognition 

That's you QUIK.



and augmented reality to eye-tracking technology. Co-exhibitors to date feature: Cinder SolutionsPNI Sensor Corp.QuickLogicand ZMDI. Booth sponsors include: AkusticaBosch Automotive Electronics and Bosch Sensortec GmbH.

Let's see its CES and the MEMS ecosystem is there so where are the MCU folks, Silicon labs, Atmel, Microchip, a dozen others,  the DSP people like Audience,  sometimes showing up is 80% of the job.
QUIK and PNI are showing up and the rest are no shows.  It's telling that they do not back up their talk with
a presence with the MEMS ecosystem.  there will be a reward one day for the showing up at the MEMS booth...they will also show up in some nice new devices? THat's what the adjacent possible says about that.












Wednesday, December 3, 2014

MIG INVITES CE OEMS AND INTEGRATORS TO “SENSORS AND MEMS TECHNOLOGY” AT 2015 INTERNATIONAL CES

10 hours ago   (0 Comments)
Posted by: MEMS Industry Group
--MEMS Industry Group speakers explore wearable devices and the IoT

PITTSBURGH – (December 3, 2014) -- MEMS Industry Group (MIG)’s conference track at the 2015 International CES®, “Sensors and MEMS Technology presented by MEMS Industry Group,” gives consumer electronics original equipment manufacturers (OEMs) and embedded systems integrators an inside look at sensors and MEMS — the component technology integral to wearable devices and the Internet of Things (IoT).
Enabled by micro-electromechanical systems (MEMS) and sensors, sensor hubs/SoCs, sensor fusion, low-power wireless connectivity, and specialized software development platforms, wearables represent one of the fastest-growing market segments in consumer electronics. And according to IHS Technology[i], shipments of sensors used in wearables will grow seven-fold from 2013-2019, from 67 million units to 466 million units.
“Wearables are poised to grow on a massive scale but the challenge and opportunity for consumer electronics OEMs and integrators is to sow the seeds of brand dominance while the market is still emerging,” said Karen Lightman, executive director, MEMS Industry Group. “Many wearable applications require multi-axis motion sensing, environmental sensing, hardware and software sensor fusion, and other MEMS- and sensors-based functionality. Understanding how to leverage this functionality to best advantage will differentiate the truly successful from the rest of the increasingly crowded pack.”
Conference Agenda

·Welcome and Opening Remarks — Karen Lightman, executive director, MEMS Industry Group
·Challenging Developers to “Make it Wearable” — At 2014 CES, Intel launched its “Make it Wearable” development challenge to “encourage innovation in wearable technology and help create new connected experiences.” Steven Holmes will share some of the most compelling new developments arising from the challenge.
·Speaker: Steven Holmes, vice president - New Devices Group & General Manager - Smart Device Innovation, Intel Corporation
·Transforming Wearables through Bluetooth Smart  power efficiency is more important to wearables than to any other product category, including smartphones. Bluetooth Low Energy fulfills a critical requirement for low-power wireless connectivity in wearables, enabling new applications for remote controls, watches, and healthcare/wellness equipment.
Speaker: Vincent Gao, technical program manager, Bluetooth Special Interest Group (SIG)
·Beyond Audio with Biometric Earbuds — the ear is the best place in the body for biometric measurement, say some sensor design firms. And they are embedding tiny optomechanical sensor modules in earbuds to prove it. Biometric earbuds will change gaming, performance coaching and fitness training.
Speaker: Dr. Steven F. LeBoeuf, president, Valencell, Inc.
·Wearables: A Very Real Market Opportunity — market analysts are closely following the market for wearables — but predictions on market size as well as the next ‘killer app’ beyond fitness & activity monitors vary greatly. Top market analysts will predict market trends and opportunities in wearables.
Panelists to date: Marwan Boustany, senior analyst for MEMS and Sensors in Mobile and Consumer Technology, IHS Technology; Jim Feldhan, president, Semico Research; Kevin Harwood, consulting architect, Mutual Mobile; and Seppo Nissila, CEO & managing director, SilverBlip
·MEMS and Sensors for a Smart IoT — MEMS and sensors are the bedrock of a smart Internet of Things (IoT) — spanning consumer, automotive, medical and industrial markets. Panelists will discuss how improved sensing technologies, smaller form factors and more integration will help unleash the considerable opportunities predicted for the IoT.
Moderator: Bruce Kellerman, senior director - product marketing -Semiconductor Materials, SunEdison
Panelists to date: David Allan, president, Virtuix; John Hoye, director, partnerships, Evernote Corporation; Mark Ireland, vice president, Semiconductor Products and Services, IBM; and Charlene Marini, vice president of marketing - Embedded Segments, ARM
·Waiting for the Holy Grail for Data — with the next breakthrough in health sensors, consumers are poised to generate the holy grail of medical research: clinically accurate, contextual and continuous data. These sensors collect 400,000 vital signs per person, per day, creating an unprecedented opportunity to understand health.
Speaker: David He, CTO, Quanttus
·The Dynamic Duo: Wearables and People Analytics — wearables have a long history as an integral part of the workplace, but their real power comes from the behavioral data they generate. Pairing data from wearables with micro-level outcome data enables true people analytics: online-style behavioral analysis and A/B testing in the real world at an unprecedented scale.
Speaker: Ben Waber, president & CEO, Sociometric Solutions
·Getting to Low Power and Maximum Functionality through Sensor Fusion — consumers demand greater functionality in smaller, more power-efficient wearables. With diverse approaches — hardware/software sensor fusion, integrated ‘sensor hubs’ or some combination thereof— how can consumer OEMs and embedded systems integrators take full advantage of MEMS and sensors for wearable devices?
Panelists: Behrooz Abdi, president and CEO, InvenSense; Stefan Finkbeiner, CEO and general manager, Bosch Sensortec; Becky Oh, board of directors, PNI Sensor Corp.; Timothy Saxe, CTO, QuickLogic; and Benedetto Vigna, executive vice president and general manager, Analog, MEMS & Sensors Group, STMicroelectronics

Visit MIG on the Show Floor

The MIG booth is in a space dedicated to sensors- and MEMS-enabled products, featuring everything from gesture recognition and augmented reality to eye-tracking technology. Co-exhibitors to date feature: Cinder SolutionsPNI Sensor Corp.QuickLogicand ZMDI. Booth sponsors include: AkusticaBosch Automotive Electronics and Bosch Sensortec GmbH.
The MIG booth is located in Tech West, Sands Expo, Level 2, Booth 72032 and will be open January 6-9, 2015 during 2015 CES exhibition hours.
Conference Registration Information