This folder will be for some work on this, they are BIG, so it will be a work in progress.

http://www.techdesignforums.com/blog/2014/09/10/foxconn-wishlist-wearables-internet-things/

this is the snip we want

With its Hon Hai arm looking to develop Foxconn wearables/Internet of Things products – the company set up a

wearables incubator last year – the often secretive technology giant offered an overview of necessary technologies during a presentation at Semicon Taiwan in Taipei

.

look at this snip….nice potential and nice to hear someone as BIG as them say it 

Addressing the low power, communications and sensor requirements for both wearables and the Internet of Things, Jason Tsai, senior manager for Innovation in Digital Systems at Foxconn’s Hon Hai Precision Industries, said, “We strongly suggest that ARM develops something suitable for a wearable device. Even the Cortex M0 [ARM’s smallest processor] is not suitable as a WPU.”

Even an M0 is NOT suitable ….
Foxconn’s IoT/wearables design strategy
Foxconn breaks down the infrastructure for the wearables/IoT market into an 11-3-2 matrix by screen size, network and cloud type. This in turn feeds into eight ‘lifestyle’ use types (see illustration).
The 11-3-2 matrix for wearables and the Internet of Things, and target markets (Foxconn)
The 11-3-2 matrix for wearables and the Internet of Things, and target markets (Foxconn)
According to these markets and their demands, Foxconn has gone on to identify the IC requirements for projects that address the market’s low, middle and high ends.
Notwithstanding the need for the WPU, Tsai said that company can see applications at the low-end today for, say, the ARM Cortex M or silicon based on the 8051 architecture.
At the middle end, Cortex R or MIPS configurations can be used. But, at the high end, as ‘big data’ makes more demands, 64bit ARM v8 and general purpose GPU options come into their own.
But these essentially seed initial development and early adopter devices. More is needed.
Beyond further innovations in the CPU and OS, Foxconn’s other technology demands for wearable/IoT devices include more cost effective dynamic voltage scaling for power management and fingerprint sensors with 500dpi resolution.
Foxconn exports cost-down model to wearables
As is generally acknowledged, cost will be the critical factor in realizing successful wearable/IoT products. Foxconn’s 11-3-2 matrix illustrates, however, that the market may tend more towards a plethora of vertical design requirements rather than the kind of flat horizontal ones that would more easily lend themselves to savings through mass production.
Nevertheless, Foxconn has identified the typical wearables product as needing to incorporate five ‘IC requirements’:
SoC (apps processor)
Memory
Connectivity
Peripherals
Sensor
Its approach now is to take the same IE-ECRS business methodology it uses to achieve efficiencies in factories and apply it to the core of designs for wearables and the IoT. ECRS breaks down as:
Eliminate
Combine
Rearrange
Simplify
“We have accumulated a great deal of experience of using this model in manufacturing and now intend to apply the same theory to the Internet of Things,” said Tsai.
THis is just a start on this work, but with this brief look that Foxconn does NOT find ARM MCUs a workable solution for wearables, there desire to move into wearables, Getting a foot in the door at Foxconn, they employ a MILLION people….