interesting read...
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By Richard Wilson 29th June 2017
French and German researchers collaborate on future chip technologies
At the launch of the joint venture between French and German semiconductor research labs Leti and Fraunhofer, it was made clear that the scope of this initiative is wider than just the two labs, and its aim is to keep Europe at the forefront of global electronics or, at least, IoT electronics.
![[IMG]](https://static.electronicsweekly.com/wp-content/uploads/2017/06/28160333/mou2_335x212.jpg)
“In Europe we face two challenges: maintaining capability and maintaining manufacturing,” said Leti CEO Marie-Noelle Semeria.
“Otherwise,” added Hubert Lakner, chairman of Fraunhofer’s microelectronics group, “Europe will become what it is geographically, an appendage of Asia.”
Semeria spoke of national and European security and defence: “We need the independent capability to make certain components for security and defence,” she said. “We need to keep the knowledge of advanced technologies, keep the technology, and keep the capability.”
Semeria also spoke of the high-cost of modern chip development, and the need to support SMEs in developing of their products. Leti is a government-funded lab, and she sees this support as part of its remit.
The idea is that France and Germany will pool research and technology organisations (‘RTOs’) with the aim of leading in the design and manufacture of sensors, power electronics and FDSoI (fully-depleated silicon-on-insulator) semiconductors.
These have been dubbed the ‘three pillars’ of the project, and are prime technologies for IoT hardware.
Finfet CMOS – the technology which vies with FDSoI to be the technology in next-generation ICs – is not amongst the pillars. “TSMC is running with CMOS up to the end of Moore’s Law. This is not the route of Europe,” said Semeria.
With finfet better-suited to high speed and FDSoI better-suited to low power, in application terms this would broadly leave Asia with phone chips and Europe with IoT chips.
Of the three pillars, according to Leti’s Semaria, Europe is already leading in power and sensors.
In a separate but related EU initiative, six nations are getting together.
It appears that this Franco-German initiative is related to an un-named wider initiative amongst six countries in the EU.
German-French pooled resources include some big manufacturers, including Infineon, Bosch, Global Foundries, X-Fab, and Soitec.
According to Lanker, Germany has already put €1bn into the project this year – the large investments in Global Foundries’ Dresden fab and the Bosch fab are part of the wider plan. In has also put €350m towards a German research fab, supported by Fraunhofer and Leibnitz Institutes.
Germany has gone out on a limb here, risking the wrath of the European Commission over state aid its manufacturing industry, ahead of an expected European mechanism to legitimise such behaviour – but no one at the launch expected trouble. They are “anticipating a green light” according to Lanker and Samaria.
This mechanism would allow state aid to the electronics industry and, it appears from statements made at the Leti-Fraunhofer announcement, involves six countries – ironically, in the face of Brexit, including the UK.
An un-named British company – speculated to be Welsh wafer specialist IQE – was, and perhaps still is, due to lead a compound semiconductor project.
One country not involved is Belgium, on whose soil sits arguably the greatest semiconductor research lab in the world – IMEC.
No French money has appeared yet, but now its government upheaval is over talks between it and Leti have re-commmenced.
Both Leti and Fraunhofer expect their collaboration to be a subject of discussion at a summit between the German and French governments in two week’s time.
Is the project expecting European funding – not yet. “We hope, perhaps in a second step, we will get some European money,” said Semeria.
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21 minutes ago
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Note that in Dresden next to Glo Fo Bosch is building also.....
Bosch Plans $1.1 Billion Fab in Dresden
Dylan McGrath
6/20/2017 00:01 AM EDT
Volkmar Denner
Building the fab ranks as the single biggest investment in the more than 130-year history of the company, according to Volkmar Denner, chairman of Boch's board of management.
"By extending our semiconductor manufacturing capacity, we are giving ourselves a sound basis for the future and strengthening our competitiveness," Denner said in a press statement.
Bosch is the world's leading supplier of microelectrical mechanical systems (MEMS) sales, with 2016 MEMS sales of about $1.16 billion, according to market research firm Yole Developpement. Bosch says it currently builds about 4 million MEMS sensor a day at its fab in Reutlingen, Germany, as well as 1.5 million ASICs. Seventy-five percent of Bosch MEMS sensors are used in communications and consumer electronics, Bosch said.
The fab in Dresden, which will eventually employ up to 700 workers, is needed to satisfy demand generated by the growing number of Internet of Things (IoT) and mobility applications, Bosch said.
—Dylan McGrath is the editor-in-chief of EE Times
QUIK can you give them some flexibility for iot...thanks
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27 minutes ago
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a snip...
Dresden’s microelectronics cluster, also known as “Silicon Saxony,” is unrivaled in Europe. It includes automotive suppliers and service providers, as well as universities offering technological expertise. In addition, the Digital Hub Initiative launched by the BMWi aims to make Dresden an IoT ecosystem. Bosch intends to collaborate closely with local companies, and in this way to reinforce not only Germany’s, but also Europe’s position as an industrial location. “This is a further good decision for Europe’s leading microelectronics cluster here in Saxony. I would like to thank Bosch for putting its trust in this location, its workforce, and Saxon innovativeness. Novel products for the internet of things and connected manufacturing are among the most important topics in the microelectronics sector, and in European industry as a whole,” said Stanislaw Tillich, the Minister-President of Saxony.
So for the casual reader...
Some things in the BIG pic just group together...over n over....
IoT silicon a focus now, as it is growth.
eFPGA fits with IoT.
IoT fits with FDX.
So will track along.
Dresden has chosen to spend its BILLIONs on a IoT ecosystem...The FDX, the IP, etc.
FDX is gonna be BIG for IoT so it seems.
From all the reading I have done Glo FO must be feeling very good FDX is doing so well, so well for this IoT stuff.
The dots will start to connect...so I have noted all the names putting their shoulders to the wheel for Silicon Saxony for IoT
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