background for those just starting...

TO be complete I went back to the Q2 cc for this snip...

Let's turn now to the smartphone market. We are getting very close to being able to classify the first of our ongoing smartphone engagements as a design win. If we are successful, we anticipate initiating shipments to support production during Q1 2018. This opportunity has shifted roughly two quarters from our original production timeline expectations. While delays are frustrating, the good news is that the design has expanded from a simple sensor hub function to one that now includes a carrier-driven requirement for always-on voice as well. This means the design will leverage several elements of the EOS S3 silicon platform including ARM Cortex M4F MCU, LPSD, and FFE. This puts us in the lead position from a competitive standpoint since we are the only multi-core MCU-based solution in the market today that can address all of these in a single chip.

then they said




During the last year we have been working closely with a major Japanese Smartphone OEM that is targeting EOS S3 for new modelsscheduled to launch in 2018. We recently shipped prototype units to this OEM for a concept Smartphone that they are intending to showcase at Mobile World Congress in Barcelona during late February. If their lead Japanese carrier mandates certain features enabled by EOS S3, the OEM will introduce a high-volume flagship Smartphone with that carrier during Q2 2018 that is based on the concept design.