very nice read here...read it more than once. 5 starrs


http://www.eejournal.com/archives/articles/20170110-iot-administration/

2017 - The IoT Administration Begins

A New Leader for Electronic Design

It is nice to read it, especially if you already heard todays presentation....

At the base semiconductor level, the challenge is no longer “Cramming More Components onto Integrated Circuits.” Instead, it’s more subtle - like “cramming more different types of highly-efficient components into smaller, cheaper modules.” Many IoT edge devices need to sip the tiniest rations of power while keeping at least some “always on” monitoring of MEMS and other sensors. This means integration of digital, analog, and even MEMS into low-cost, small-form-factor, ultra-low-power packages. The ability to stitch disparate types of technology together on one silicon substrate or interposer - logic, memory, analog - perhaps even MEMS - is a formidable weapon in the IoT edge war.

In fact, one of the most critical concepts in IoT may be heterogeneous distributed processing
Decomposing complex, system-level algorithms into pieces that can run in parallel on application-appropriate optimized hardware accelerators of various types (FPGAs, GPUs, MCUs, real-time processors, low-power application processors, and big-money server processors), putting the appropriate types of workloads onto the correct processing nodes at the correct place in the signal chain (optimizing computation, networking, and storage resources) is a daunting challenge that we have only begun to address in the most primitive fashion.